Product name: 10-layer high multi-layer soft and hard combination board
Layers: 10L
Rigid-flex board structure: 3R+4F+3R
Plate thickness: 1.8mm
Outer/inner layer copper thickness: 1Oz
Minimum hole diameter: 0.1mm
Minimum Line Width/Space: 5mil
Surface treatment: ENIG + OSP (anti-oxidation)
Process Difficulties: High Multi-layer Rigid-Flex Board
Application Field: Power Equipment