IC Bonding Board
7/8/2023 11:12:28 AM
Introduction
| Product name | IC Bonding Board |
| Layers | 2 |
| Material | Guoji TG130 |
| Plate thickness | 1.6mm |
| Dimensions | 75mm*38mm |
| Minimum aperture | 0.3mm |
| Minimum line width and line spacing | 0.175mm/0.175mm |
| Hole copper thickness | 18um |
| Outer copper thickness | 35um |
| Surface treatment | Immersion Gold 1.5u'' |
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