Teflon + FR4 mixed voltage high frequency circuit board
Number of layers: 4 layers of high-frequency PCBs
Material: Teflon
Plate thickness: 2 soil 0.2mm
Minimum aperture: 0.3mm
Dielectric constant: 2.85±0.05
Dielectric loss factor: 0.0033
Line width and line spacing: 0.152mm/0.175mm
Surface treatment: immersion nickel gold
Process features: Teflon and FR4 mixed pressure technology
Application Field: Communication Base Station Power Amplifier
Introduction
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