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The 5G spectrum allocation plan is about to be introduced, and the PCB industry chain is facing a good opportunity for historical development

    On September 26th,the 2018 China International Information and Communication Exhibition(PT Exhibition)was held in Beijing.It is worth noting that 5G spectrum allocation has entered the countdown.Previously,officials from the Ministry of Industry and Information Technology stated that they are fully promoting and will make timely announcements.
  Yang Hua,Secretary General of TD Industry Alliance,revealed that the Ministry of Industry and Information Technology has organized multiple research and development meetings on 5G spectrum allocation,and consensus is being reached among all parties.It is hoped that a spectrum plan will be formed and made public before the end of October.
  Hong Jianguo,a specially appointed Financial analyst of China Financial Exchange,believes that with the countdown of 5G spectrum allocation,the development of China's 5G industry will enter a fast lane,and the industrial chain will usher in a good opportunity for historical development.
  Recently,the Ministry of Industry and Information Technology and the National Development and Reform Commission issued the Three Year Action Plan for Expanding and Upgrading Information Consumption(2018-2020),which includes accelerating 5G construction,ensuring 5G commercial use,and improving the innovation level of Consumer electronics supply.
  With the accumulation of early investment in research and development of 5G technology,China has solved the key technology validation and technical solution validation.The system solution validation test results are also expected to be released in the near future,and the research and development experiments of 5G products will also follow.With the implementation of policies to promote the development of 5G and the standardization process of international 5G,the development of 5G is expected to enter the fast lane.
  Looking back at the era of 3G and 4G,Qualcomm in the United States has led the development of relevant standards.In the 5G era,the participation of Chinese enterprises has significantly increased,and their advantages are becoming increasingly evident.In the report issued by the American Wireless Communications and Internet Society,China's 5G commercial technology has ranked first in the world.
  Data shows that China currently supports 10 times more 5G communication base stations than the United States,while the cost of installing necessary equipment to increase 5G capacity in China is about 35%cheaper than in the United States.According to public media reports,the United States is being surpassed by China in the 5G construction competition and may lose potential economic benefits.
  Hong Jianguo believes that it is currently the opportunity for China to overtake on the curve under the global leading goal of 5G,and with the direct benefits of 5G landing in the industrial chain,enterprises are expected to enter the high-speed growth track.
  It is reported that the 5G base station structure has been upgraded from BBU+RRU+antenna in the 4G era to a three-level structure of DU+CU+AAU.The total number of base stations will increase from 3.75 million in 2017 to 14.42 million in 2025,with a huge increase in market size.Three factors will bring opportunities for significant performance improvement in related industries.
  Firstly,there are changes in the PCB(printed circuit board).In the 5G era,PCB is expected to experience a situation of simultaneous increase in quantity and price.As the frequency band increases,the demand for high-frequency and high-speed materials in 5G base stations increases;More and higher requirements are also put forward for the processing difficulty and process of PCBs,and the value of PCBs has increased.According to calculations,the area of PCBs required for 5G base stations will increase by 4 to 6 times,and the significant increase in demand is bound to help improve the performance expectations of related companies.
  Next is the change in copper clad plate.High frequency and high-speed substrates are also expected to enter a high growth stage.In traditional 4G base stations,the power amplifiers in RRUs mainly use high-frequency copper clad plates,while the rest mostly use FR-4 copper clad plates.However,due to the significant increase in data transmission and higher RF requirements,5G is expected to use more high-frequency high-speed copper clad plates.
  Finally,there are changes to the IC carrier board.With the production of 15 new wafer factories in the domestic IC industry from 2018 to 2020,and the addition of 3.5 billion yuan in IC carrier market space,it is expected that the domestic IC carrier industry will usher in a good opportunity for rapid development.