Introduction
▪Number of layers-6L
▪Material-DS7409-HGB
▪Plate thickness-0.5mm
▪Inner and outer copper thickness-H/H oz
▪Minimum line width/line spacing-0.05/0.04mm
▪Minimum aperture-0.07mm
▪Surface treatment-nickel palladium
Teflon High-Frequency Board
Rogers Rf High-Frequency Board
Outer 6oz Inner 3oz Copper Conducted Fr4 Circuit Board
Rogers+Fr4 Hybrid Laminated High-Frequency Circuit Board
Teflon+Fr4 Mixed Voltage High-Frequency Circuit Board
Hybrid Laminated Pcb Circuit Board
Ro3003+Fr4 High-Frequency Mixed Pressure Plate
Ro4003c+Fr4 High-Frequency Mixed Pressure Plate