Introduction
Number of layers-8L
▪HDI(2+N+2)
▪Microporous structure-L1-L2,L2-L3,L6-L7,L7-L8
▪Buried hole-L2-L7
▪Minimum pad size-3.0milx3.0mil
▪Minimum pad spacing-2.8 mils
▪Surface treatment-nickel palladium precipitation
Teflon High-Frequency Board
Rogers Rf High-Frequency Board
Outer 6oz Inner 3oz Copper Conducted Fr4 Circuit Board
Rogers+Fr4 Hybrid Laminated High-Frequency Circuit Board
Teflon+Fr4 Mixed Voltage High-Frequency Circuit Board
Hybrid Laminated Pcb Circuit Board
Ro3003+Fr4 High-Frequency Mixed Pressure Plate
Ro4003c+Fr4 High-Frequency Mixed Pressure Plate