Nickel Palladium Ic Carrier Plate
7/8/2023 10:20:43 AM
Introduction
| Product name | Nickel Palladium Gold IC Substrate |
| Layers | 2 |
| Material | BT material |
| Plate thickness | 0.25 |
| Minimum aperture | 0.1 |
| Surface treatment | Nickel Palladium 4 Mai |
| Special Process | Grinding and leveling/dry film solder mask should |
| Application field | IC package substrate |
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