Name: WIFI module half-hole circuit board
Plate: FR4 material
Layers: 4-layer through-hole board
Minimum line width: 0.075mm (3mil)
Minimum line spacing: 0.075mm (3mil)
Minimum aperture: 0.2mm
Finished plate thickness: 1.0mm
Finished copper thickness: 1OZ (35um)
Surface technology: chemical immersion gold + OSP anti-oxidation
Application: WiFi module
Process features: half hole diameter 0.4mm
Introduction
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