Ic Packaging Substrate
7/8/2023 10:05:25 AM
Introduction
Product name: IC package substrate
Number of layers: 4-layer circuit board
Plate: NPG-180IN
Plate thickness: 0.40mm: 0.03MM
Minimum line width and line spacing: 0.04MM/0.03MM
Minimum drilling: 0.075MM
Solder resist ink: green AUS320
Surface technology: Immersion nickel palladium gold (ENEPIG)
Package type: BGA package
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