3-stage HDI arbitrary interconnection PCB circuit board
Application fields: high-end smart phones
Product features: any interconnected material
Material: Shengyi S1000-2M
Layers: 8L
Plate thickness: 1.8±0.13mm
Minimum aperture laser blind hole: 0.1mm minimum line width/line spacing 75/75um
Surface technology: immersion gold on the surface, thickness: 2u”
Introduction
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