Six-layer thick copper immersion gold circuit board
Layers: 6L
Plate thickness: 3.75±0.38mm
Minimum aperture: through hole: 0.25mm blind hole: /0.15mm
Line width and line spacing: 0.1mm/0.1mm
Surface treatment: immersion nickel gold
Copper thickness: inner layer 4OZ, outer layer 60Z
Process: pressing, drilling, solder mask special parameter control
Application field: power supply
Introduction
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