8-layer high-current conductive copper power control circuit board
Layers: 8L
Plate thickness: 2.4±0.15mm
Plate: Shengyi
Minimum aperture: 0.8mm
Surface treatment:ENIG
Minimum hole copper: 50um inner and outer layer copper thickness: 140um gold thickness: >=2u
Process features: high multi-layer, thick copper, inductance control
Surface treatment: immersion gold
Introduction
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